Dec. 04, 2023
Beijing Rdekono Electronic Equipment Co., Ltd. has reached a new milestone in technological innovation. The China National Intellectual Property Administration (CNIPA) has officially granted invention patents to two core technologies independently developed by Rdekono:
"A reinforced side panel structure with integrated front flange and rear cover plate installation" — Patent No.: CN 219628252 U
"A plug-in structure with horizontal board installation" — Patent No.: CN 219738096 U
These certifications mark a major step forward in Rdekono’s commitment to scientific and technological innovation, especially in the field of modular subrack systems for communication, railway, and industrial electronics.
These newly patented structures were developed to improve the mechanical performance, modularity, and installation efficiency of 19-inch subrack systems:
The reinforced side panel ensures better load-bearing capacity, while the integrated flange and rear plate improve vibration resistance—ideal for applications in railway electronics and power control systems.
The horizontal plug-in structure provides easier board insertion, enhanced electromagnetic shielding, and support for dense component layouts—especially useful in telecom and smart grid systems.
These innovations are now incorporated into Rdekono’s customized subrack solutions, helping clients meet demanding requirements for reliability, protection, and scalability.
Explore our customized solution offerings.
Since its founding, Rdekono has placed innovation at the core of its strategy. Through continuous R&D investment, optimization of our technical teams, and a firm focus on independent intellectual property rights, Rdekono has developed advanced structural designs that comply with both EMI shielding requirements and international rack standards (EIA, IEC).
These achievements enhance our competitiveness in the global market and empower our partners with high-performance electronic packaging solutions.
View our full list of certificates and patents.
Scientific exploration and technological innovation are the main forces driving the progress of human civilization and social development. The successful authorization of this patent certificate has further promoted the development of Rdekono in the fields of technological innovation and independent intellectual property.
Scientific exploration and technological innovation are the engines of social development. The successful certification of these two patents reaffirms Rdekono’s dedication to pushing the boundaries of subrack design, modular integration, and high-reliability applications.
In the future, Rdekono will continue to:
Expand its patent portfolio and global intellectual property strategy
Innovate in key areas such as heat dissipation, material optimization, and shock resistance
Deliver reliable, scalable, and customized electronic packaging for industrial and transportation clients
We remain committed to becoming a global leader in high-end subrack solutions.
Oct. 01, 2023
For PCB board of the subrack insertion and extraction, Provides assistance when pulled out.Composed of four parts: handle, scutcheon, printed board bracket, and shaft. Handle material: PC+GF20%, Fire retardant standard: UL94V1, printed board bracket material: die-cast zinc alloy surface nickel plating.
Oct. 08, 2023
The subrack does not have a series of profiles, and after receiving an order, it is usually customized and processed according to the drawings. Products from different customers and products of different specifications from the same customer all need to be redesigned and processed, resulting in higher costs;